Coolbox H70 is a 2 g thermal compound for improving heat transfer between a CPU or graphics chip and its heatsink. Verified specs include 3.17 W/m·K thermal conductivity, 0.0067 °C/W thermal resistance, a gray color, and an operating range from -30 to 240 °C. It is intended for standard PC maintenance and reapplication on processors, GPUs, and similar components that use thermal paste. The consulted documentation also indicates an applicator is included.
Compatibility
CPUs
graphics chips
chipsets with a standard heatsink interface
Frequently asked questions
Which systems is this suitable for?
It is suitable for PCs and components that use standard thermal paste, including CPUs, graphics chips, and related heatsinks.
What is included for installation?
The consulted product documentation indicates a 2 g syringe of thermal paste and an applicator for application.
FT-A9DB93846988DCB20FAE
123 Items
Data sheet
Color
Gray
Compatible printers
CPUs, graphics chips, chipsets with a standard heatsink interface
Technology
Thermal paste
Condition
New
Dimensions
Syringe format
Capacity
2 g
Specific References
Coolbox H70 thermal paste in a 2 g syringe, with applicator included, for better heat transfer between components and heatsinks.